Devices & Assemblies

SABIC's Specialties Business Improved flow PC with excellent processability and mold release. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

SABIC's Specialties Business LEXAN™ EXL1613T polycarbonate (PC) siloxane copolymer resin is a transparent injection molding grade. This resin offers extreme low temperature ductility in combination with medium flow characteristics and excellent processability with opportunities for shorter IM cycle times compared to standard PC. LEXAN™ EXL1613T resin is a general purpose product available in transparent and opaque colors and is an excellent candidate for a broad range of applications. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

SABIC's Specialties Business Enhanced Flow Polyetherimide in 350 micron powder. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

SABIC's Specialties Business LNP ELCRIN 61000EUiQ2 (also known as ELCRIN ER011566) is based on Polycarbonate / Polybutylene Terephthalate (PC/PBT) alloy, utilizing iQ PBT generation 2 technology with 23% post consumer recycled content. Added features of this material include: excellent low temperature impact strength, improve retention of mechanical properties under UV exposure, good surface esthetics, good chemical resistance. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

jER™ YL980 is is a Bisphenol A-type liquid epoxy resin with very low chlorine content. It can be used for electrical and electronic applications (Sealant, casting agent, adhesives, and so on). Benefits Excellent adhesiveness Maintains high electrical reliability Features Chemical, heat and water resistant Electrical insulating properties Significantly low chlorine content (below 500 ppm) Applications Electrical and electronic applications Potting & encapsulation materials Adhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YX8040 is a hydrogenated bisphenol A-type solid epoxy resin, with high molecular weight. It can be used for optical materials such as LED encapsulants and adhesives for displays.FeaturesHigh purityTransparencyLED-curableUV-curable *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YL983U is a Bisphenol F-type liquid epoxy resin with very low chlorine content and low viscosity. It is used for electrical and electronic applications (Sealant, casting agent, adhesives, and so on). BenefitsExcellent adhesivenessGood elastic recovery FeaturesChemical, heat and water resistantElectrical insulating propertiesSignificantly low chlorine content (below 500 ppm)Low viscosityApplicationsElectrical and electronic applications Potting & encapsulation materialsAdhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YX7105 is a liquid-type epoxy resin with toughness, flexibility, and high stretchability. It is used as an impact modifier for semiconductor, printed electronics and wearable devices to avoid bending and warpage. jER™ YX7105 is an adduct formed from the reaction of epichlorohydrin and an aliphatic and aromatic polyol.FeaturesExcellent adhesionGood toughnessGood mechanical, impact and crack resistanceExcellent elasticity and flexibilityApplicationsPrinted electronics (resist ink, build-up wire board, flexible printed wire board, metal core printed circuit board)Semiconductor manufacturing (liquid mold compound, underfill, sidefill, diebonding, ACF, NCF, ACP, NCP)Base film and sheet for wearable devicesCoatingsAdhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

SABIC's Specialties Business Improved flow PC with excellent processability and mold release. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

SABIC's Specialties Business LEXAN™ EXL1613T polycarbonate (PC) siloxane copolymer resin is a transparent injection molding grade. This resin offers extreme low temperature ductility in combination with medium flow characteristics and excellent processability with opportunities for shorter IM cycle times compared to standard PC. LEXAN™ EXL1613T resin is a general purpose product available in transparent and opaque colors and is an excellent candidate for a broad range of applications. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

SABIC's Specialties Business LNP ELCRIN 61000EUiQ2 (also known as ELCRIN ER011566) is based on Polycarbonate / Polybutylene Terephthalate (PC/PBT) alloy, utilizing iQ PBT generation 2 technology with 23% post consumer recycled content. Added features of this material include: excellent low temperature impact strength, improve retention of mechanical properties under UV exposure, good surface esthetics, good chemical resistance. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

LNP THERMOCOMP ZX08005 compound is based on Polyphenylene Ether / Polystyrene (PPE/PS) blend containing unreinforced. Added features of this grade include: Improved Dielectric Properties.