Products in Electrical & Electronics: Laminate

Woven glass fabric, melamine resin laminate. NP509 is very hard, flame resistant, machining grade with excellent electrical properties in high humidity conditions. NP509 has high physical strength and excellent arc resistance. Meets MIL-I-24768/1 type GME, MIL-I-24768/8 type GMG and IEC 60893-3-3-MF GC 201.

Paper phenolic grade with better electrical properties than NP612. NP625 requires slightly more heat to shear and punch than NP612. Certification to IEC standard is pending.

A paper-base laminate with low phenolic resin content for hard, flat surfaces. It is typically hot punched for numerous low voltage electrical applications of less than 250 volts where the material is not subjected to high humidity.

Hot punching general-purpose phenolic grade. Mechanical properties approach those of NP610 with improved electrical properties and moisture resistance. Certification to IEC standard is pending.

NP613 is constructed from electrical grade of kraft paper and a specially modified epoxy resin system. It is designed to be used in tap changers, coil support plates and terminal panels for transformers and their accessories.

MC511AF is a high strength, medium weave glass epoxy laminate that retains a minimum of 50 percent of its room temperature flexural strength when tested at 150ºC. Typical applications include insulation in power generation equipment and other structural applications when used in elevated temperatures. MC511AF is certifiable to MIL-I-24768/3, Type GEB.

Lower cost paper phenolic NEMA Grade XP. NP660 uses natural kraft paper without pigmented cover sheet. It is a warm to hot punching material. It is available in natural and black only, without a pigmented cover, only. Certification to IEC standard is pending.

A paper-base laminate with low phenolic resin content for hard, flat surfaces. This material is normally used in the printed circuit board industry as a backup for the drilling operation. However, it is also used in other industries for tooling stock because of its ease of machining and good dimensional stability.

MC511FR is a high strength, medium weave glass epoxy laminate that retains a minimum of 50 percent of its room temperature flexural strength when tested at 150ºC. Typical applications include structural applications when used in elevated temperatures. MC511FR also complies with MIL-I-24768/28, Type GEB-F. Certification to IEC standard is pending.

NP630 is a fine machining grade with excellent electrical properties and moisture resistance. It has low cold flow with good dimensional stability.

Hot punching general-purpose phenolic grade. Mechanical properties approach those of NP610 with improved electrical properties and moisture resistance. NP611 meets the requirements of IEC60893-3-4-PF CP 201.

A paper-base laminate with low phenolic resin content for hard, flat surfaces. This material is most commonly used for drill entry material in the PCB industry.

Canvas phenolic laminate with molybdenum disulphide added as a solid lubricant. This material has improved wear properties under certain conditions. Material is semi-conductive to electricity and should no be used where this is detrimental to the application.

Hot punching grade with excellent electrical properties and low moisture absorption. Major application is for punched parts for switches and other insulation applications requiring high electrical strength in applications where either moisture is present or in areas of high humidity.

NP629 is a paper-phenolic high-pressure laminate and intended primarily for mechanical applications, but is suitable for electrical applications as well. The electrical properties are not quite as good as those of NP630. Certification to IEC standard is pending.

MC511A is a high strength, glass epoxy laminate that is specially formulated to meet power generation producer’s exacting standards where higher strength at elevated temperatures are required. MC511A is certifiable to MIL-I-24768/3, Type GEB, IEC-60893-3-2 EP GC 203 and is halogen free to meet the European restrictions.

NP643 is constructed from an electrical grade kraft paper and a high temperature specially modified epoxy resin system. It is designed to be used in tap changers, coil support plates and terminal panels for transformers and their accessories.

Room temperature punching and shearing paper phenolic grade up to .125" thick. NP612 is more flexible with lower mechanical properties than NP611, and is intended for applications where electrical and moisture requirements are of secondary importance. NP612 meets the requirements of MIL-I-24768/20.

Phenolic paper based grade for mechanical applications. Good tensile, compressive and flexural strength. Primarily a machining material, but may be hot punched up to .093" thick. NP610 meets MIL-I24768/12 Type PBM, ASTM D709 Type X and IEC 60893-3-4 PFCP 201.

NP572 is a high strength, medium weave glass epoxy laminate that retains a minimum of 50 percent of its room temperature flexural strength when tested at 150ºC and its Tg is guaranteed to be 180°C or greater. Typical applications include electrical equipment subjected to elevated temperatures. NP572 is certifiable to IEC 60216-3, IEEE STD 98-2002 and ASTM D2304 for Class H insulation in electrical devices. NP572 is also certifiable to MIL-I-24768/3, Type GEB.

Low cost room temperature punching grade with mechanical and electrical properties similar to NP612. This version is made with pigment cover plies on the surface.

Room temperature punching and shearing grade up to 0.125″ thick. NP615 is more flexible with lower mechanical properties than NP611. NP615 is produced with high resin content melamine impregnated surfaces to give the resulting laminate better arc resistance. Intended for applications where electrical and moisture requirements are secondary.

Canvas phenolic laminate with molybdenum disulfide lubricant. The mechanical properties are slightly lower than NP310. NP313 is used for lubricity in the composite when carbon (graphite) cannot be used because of conductivity.

Warm punching, composite grade with woven glass covers for improved flexural, tensile and impact strength. It has better electrical properties and higher mechanical strength than NP611.

370HR laminates and prepregs, deigned by Polyclad, are made using a patented high performance 180°C Tg FR-4 multifunctional epoxy resin system that is designed for multilayer Printed Wiring Board (PWB) applications where maximum thermal performance and reliability are required. We manufacture 370HR laminates and prepregs with high quality E-glass glass fabric for superior Conductive Anodic Filament (CAF) resistance. 370HR provides superior thermal performance with low Coefficient of Thermal Expansion (CTE) and the mechanical, chemical and moisture resistance properties that equal or exceed the performance of traditional FR-4 materials. 370HR is used in thousands of PWB designs and has proven to be best in class for thermal reliability, CAF performance, ease of processing and proven performance on sequential lamination designs.

35N is a pure polyimide laminate and prepreg system for applications requiring high temperature performance. High Tg (250°C) results in low Z-direction expansion for resistance to PTH failure during PWB processing, and minimizes risk of latent PTH defects in-service. Reduced temperature and time to cure offers improved throughput compared to traditional polyimide cycles.

Vetronite® EGS 619 is composed of epoxy matrix and glass fabric reinforcement. it appears in Light green color with EP GC 202 FR-4 Standards.

Acculam™ Epoxyglas G10/FR4 is a laminate sheet comprised of a flame retardant epoxy resin and a woven fiberglass substrate. This grade qualifies to NEMA FR4 and MIL-I-24768/27.This material has high mechanical strength and excellent electrical insulating qualities in both dry and humid conditions. These attributes along with good fabricating characteristics allow this grade to be used in a wide variety of electrical and mechanical applications.

CuClad 233(Er=2.33) uses a medi um fiberglass/PTFE ratio to balance lower dielectric constant and improved dissipation factor without sacrificing mechanical properties.

RT/duroid® 5870 and 5880 glass microfi ber reinforced PTFE composites are designed for exacting stripline and mi crostrip circuit applications.

Resiten® GLEM is a fine weave cotton fabric/melamine laminate with a glass epoxy interleave.

P96/P26 consist of a flame resistant, polyimide resin system suitable for military, commercial or industrial electronic applications requiring superior performance and the utmost in thermal properties. These products utilize a polyimide and thermoplastic blend resin, fully cured without the use of MDA (Methylenedianiline). This results in a polymer with a high Tg without the characteristic difficulties of brittleness and low initial bond strength associated with traditional thermoset polyimides.

Lamitex® LE PF CC 21 cotton/phenolic sheets are intended for use in electrical applications requiring good moisture resistance. It has lower mechanical strength than materials with glass substrates, but has superior impact resistance when compared to paper based laminates. LE possesses good dielectric properties and medium dielectric loss and can be machined to relatively close tolerances.

Lamitex® G-11/G-10 EP GC 22 laminated sheet is a woven glass fabric composite impregnated with an epoxy resin. It is primarily used for mechanical, electrical and electronic applications where extremely high mechanical strengths are required at room and moderate temperatures. It is frequently specified for its excellent resistance to chemicals and retention of good electrical properties in dry and high humidity environments. G-11 is non-brominated, is not flame retardant and should not be confused with a similar glass epoxy grade FR-5 which is flame retardant.

TC350™ Plus laminates are ceramic filled PTFE-based woven glass reinforced composite materials providing a cost effective, high performance, thermally enhanced material for the circuit designer. With a thermal conductivity of 1.24W/ mK, this next generation PTFE-based laminate is ideally suited for higher power microwave and industrial heating applications requiring higher maximum operating temperatures, low circuit losses, and excellent thermal dissipation within the circuit board. Additionally, the advanced filler system used enables the composite to have much improved mechanical drilling performance when compared with other competitive laminates. This will result in lower manufacturing costs during circuit board fabrication.

Versitex® VR2 is a cost-effective thermoplastic composite backed by a thin sheet of fabric to helppromote adhesion of injected or poured foam systems. These high impact resistant panels are comprisedof polypropylene resin reinforced with continuous bi-directional glass fibers. Versitex resists rot, corrosion,mildew, and is not affected by cleaning-related chemicals. Versitex VR Series panels provide significantenergy absorption over traditional FRP panels and exhibit thermal expansion similar to aluminum. Thebi-directional nature of Versitex provides consistent physical properties throughout the entire panel. Versitexis easily repaired by applying low heat.