Products in Electronics Adhesives

TEGO® Antifoam 4-94 is an APEO-free and mineral oil-free emulsion antifoam containing organo-modified siloxanes. This anti-foaming agent is designed for use in waterborne adhesive applications and is particularly compatible with substrates such as paper and wood. It falls within the category of CASE ingredients, specifically within the realm of foam control additives, presenting itself in emulsion form

Evonik VQM 973 formulations consist of vinylfunctional QM resin and vinylfunctional silicone polymers. These formulas are used to produce materials that are transparent, free of fillers, and have great mechanical qualities. They can also improve the mechanical properties and flow behavior of systems that are filled.

Evonik Polymer OH 2 is a polydimethyl siloxane with terminal silanol groups, serving as a fundamental component in the formulation of condensation-curing silicone elastomers. This product is offered in a range of viscosity levels, spanning from 100 to 400,000 mPas. In its physical form, it appears clear and colorless. Chemically, it is characterized as hydroxy-terminated polydimethyl siloxanes.

Evonik Crosslinker 120, part of the Crosslinker 100 series, consists of polydimethylsiloxanes containing SiH groups within the polymer chain. In addition to SiH groups within the chain, the Crosslinker 100 series features terminal SiH groups. These crosslinkers are essential components of polyaddition silicones. When working with two-component silicone formulations, it is crucial to maintain strict separation between Pt catalysts (e.g., Catalyst 500 series) and SiH crosslinkers to ensure proper performance.

Evonik VQM 909 formulations consist of vinylfunctional QM resin and vinylfunctional silicone polymers. These formulas are used to produce materials that are transparent, free of fillers, and have great mechanical qualities. They can also improve the mechanical properties and flow behavior of systems that are filled.

Evonik Polymer VS 500 consists of vinyl-terminated polydimethylsiloxanes available in different viscosity levels and molecular weights, with an impressively low content of volatile constituents. These polymers serve as fundamental components in silicone formulations that cure through a platinum-catalyzed addition reaction with silicone crosslinkers containing SiH groups. The minimal presence of volatile constituents and the crosslinking mechanism ensure that curing shrinkage remains low, and no volatile or corrosive substances are generated during the curing process.

Evonik Polymer OR 501 is a specialized silicone polymer designed for non-staining, condensation-curing silicone formulations. This polymer is particularly recommended for low-modulus sealants and adhesives, especially in cases where the use of silicone oils as plasticizers is not advisable, such as in natural stone applications. It is characterized as hydroxy-terminated polydimethyl siloxanes.

Evonik Modifier 715 is another SiH-terminated polydimethyl siloxane plasticizer for addition-curing silicones. These products do not crosslink but extend the chains of vinyl-terminated silicone polymers (Polymer VS). The use of these modifiers is intended to decrease crosslinking density, resulting in softer elastomers.

Evonik Modifier 705 refers to SiH-terminated polydimethyl siloxanes utilized as plasticizers in addition-curing silicones. Due to their difunctional structure, these products do not crosslink but extend the chains of vinyl-terminated silicone polymers (Polymer VS). The use of these modifiers reduces crosslinking density and, consequently, the elastomer's hardness.

ALBIFLEX® 246 is an innovative Bisphenol-A-epoxy silicone block copolymer resin designed for crafting high-performance elastomers. This liquid resin, active with epoxy, seamlessly cures when paired with aliphatic and cycloaliphatic epoxy resin curing agents. ALBIFLEX® 246 offers versatility, supporting various casting and molding methods for your manufacturing needs.

Evonik Crosslinker 100, part of the Crosslinker 100 series, consists of polydimethylsiloxanes containing SiH groups within the polymer chain. In addition to SiH groups within the chain, the Crosslinker 100 series features terminal SiH groups. These crosslinkers are essential components of polyaddition silicones. When working with two-component silicone formulations, it is crucial to maintain strict separation between Pt catalysts (e.g., Catalyst 500 series) and SiH crosslinkers to ensure proper performance.

Evonik VQM 907 formulations consist of vinylfunctional QM resin and vinylfunctional silicone polymers. These formulas are used to produce materials that are transparent, free of fillers, and have great mechanical qualities. They can also improve the mechanical properties and flow behavior of systems that are filled.

AEROSIL® R 202 is a hydrophobic fumed silica grade, treated with a polydimethylsiloxane. This product can be used in defoamer formulations for sedimentation stabilization and due to its high hydrophobicity as defoaming component.

AEROSIL® R 812 is hydrophobic fumed silica grade treated with HMDS (Hexamethyldisilazane). It can be used for sedimentation stabilization and due to its high hydrophobicity as defoaming agent.

AEROSIL® 200 is a hydrophilic fumed silica with a specific surface area of 200 m²/g.

Evonik Polymer VS 10000 consists of vinyl-terminated polydimethylsiloxanes available in different viscosity levels and molecular weights, with an impressively low content of volatile constituents. These polymers serve as fundamental components in silicone formulations that cure through a platinum-catalyzed addition reaction with silicone crosslinkers containing SiH groups. The minimal presence of volatile constituents and the crosslinking mechanism ensure that curing shrinkage remains low, and no volatile or corrosive substances are generated during the curing process.

ALBIFLEX® 297 is a bisphenol-A-epoxy-silicone block copolymer resin that excels in crafting high-performance elastomers. This versatile liquid, responsive to epoxy, seamlessly cures when combined with aliphatic and cycloaliphatic epoxy resin curing agents. ALBIFLEX® 297 accommodates various conventional casting and molding techniques for your manufacturing needs.

DYNOL® 607 is a high-performance, non-ionic superwetter capable of delivering the exceptional equilibrium and dynamic surface tension reduction synonymous with the Dynol name. It also boasts improved ease-of-incorporation and formulation compatibility compared to the more hydrophobic DYNOL® 607 Surfactant. Furthermore, comparative wetting performance tests have confirmed that DYNOL® 607 Surfactant is a valuable replacement for conventional fluorosurfactants and offers a cost-effective, non-persistent alternative to emerging fluorosurfactant technology.

Evonik Polymer VS 1000 consists of vinyl-terminated polydimethylsiloxanes available in different viscosity levels and molecular weights, with an impressively low content of volatile constituents. These polymers serve as fundamental components in silicone formulations that cure through a platinum-catalyzed addition reaction with silicone crosslinkers containing SiH groups. The minimal presence of volatile constituents and the crosslinking mechanism ensure that curing shrinkage remains low, and no volatile or corrosive substances are generated during the curing process.

AEROSIL® R 805 is a high thickening fumed silica surface treated with OCTMO.

AEROSIL® R 972 is hydrophobic fumed silica grade treated with DDS (Dichlordimethylsilane). The moderate hydrophobicity of these AEROSIL® products is suited for defoaming properties in the presence of appropriate hydrophobic liquids. They are recomended for improving the sedimentation stability of defoamer dispersions as well.

Evonik Polymer VS 100 comprises vinyl-terminated polydimethyl siloxanes available in various viscosity levels and molecular weights, featuring an impressively low content of volatile constituents. These polymers serve as essential base components in silicone formulations that cure through a platinum-catalyzed addition reaction with silicone crosslinkers containing SiH groups. The minimal presence of volatile constituents, combined with the crosslinking mechanism, ensures low curing shrinkage and prevents the formation of volatile or corrosive substances during the curing process.

jER™ YL980 is is a Bisphenol A-type liquid epoxy resin with very low chlorine content. It can be used for electrical and electronic applications (Sealant, casting agent, adhesives, and so on). Benefits Excellent adhesiveness Maintains high electrical reliability Features Chemical, heat and water resistant Electrical insulating properties Significantly low chlorine content (below 500 ppm) Applications Electrical and electronic applications Potting & encapsulation materials Adhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YX7400N is an adduct formed from the reaction of epichlorohydrin and an aliphatic polyol.FeaturesAdduct formed from the reaction of epichlorohydrin and an aliphatic polyolExcellent elasticityImpact resistanceApplicationsConsumer appliances and electronicsElectrical devices, assemblies, parts and componentsElectronics adhesivesElectrical and electronic packaging and assemblySpecialty and conformal coatingsPotting compoundsPrinted circuit boards (PCBs)Semiconductor manufacturing*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YX8040 is a hydrogenated bisphenol A-type solid epoxy resin, with high molecular weight. It can be used for optical materials such as LED encapsulants and adhesives for displays.FeaturesHigh purityTransparencyLED-curableUV-curable *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

SHIKOH™ UV-3700B is UV curable urethane acrylate oligomer with high elongation and soft rubbery elasticity. It is relatively low viscosity despite its high molecular weight. EB and Thermal cure systems are also applicable. Features Soft elastic type, High elongation High molecular weight but relatively low viscosity Non-solvent (100% hardening ingredient) For UV adhesion with monomers Non-yellowing Applications Adhesive: UV/ EB/ Thermal-curable adhesive for electronics device, optical use and automotive use. 3D printer *SHIKOH™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YX4000 is a biphenol-type solid epoxy resin with significantly low melt viscosity, low water absorption and a good balance between adhesiveness and rigidity against stress. It can be used for electrical and electronic applications. jERTM YX4000 is an adduct formed from the reaction of epichlorohydrin and tetramethylbiphenol FeaturesAbrasion, heat and water resistanceElectrical insulationWear resistanceProduct HighlightsSignificantly low melt viscosity (melting point: 108°C)Low chroline contentLow water absorption ApplicationsElectrical and electronic applications (EMC, solder resist, PCB)Potting and encapsulation materialsPowder coatings for ship bottomsAdhesivesComposites *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YX8000D is a hydrogenated bisphenol A-type liquid epoxy resin with significantly lower chlorine impurity levels than other commercially available products. It can be used for wide variety of optical adhesives and encapsulants.FeaturesExcellent adhesionFast cure timeLow chlorine contentExcellent transparencyLED-curableUV-curableApplicationsConsumer appliances and electronicsElectrical and electronic displaysElectronics adhesivesPotting compoundsSemiconductor manufacturingLEDs*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YL983U is a Bisphenol F-type liquid epoxy resin with very low chlorine content and low viscosity. It is used for electrical and electronic applications (Sealant, casting agent, adhesives, and so on). BenefitsExcellent adhesivenessGood elastic recovery FeaturesChemical, heat and water resistantElectrical insulating propertiesSignificantly low chlorine content (below 500 ppm)Low viscosityApplicationsElectrical and electronic applications Potting & encapsulation materialsAdhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

SHIKOH™ UV-3520TH is an aliphatic urethane acrylate oligomer with soft elasticity, good toughness and high elongation. It shows unique mechanical properties with various reactive diluents. Features Soft-Elastic type, Good toughness, High elongation Diluted in Tetrahydrofurfuryl Acrylate (THFA) (oligomer/ THFA = 70/30 wt%) Non-solvent (100% hardening ingredient) Unique mechanical properties with various reactive diluents Applications UV/ EB/ Thermal-curable adhesive UV adhesive for electric device use 3D printer, and Inkjet *SHIKOH™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ 1256 is a solid epoxy resin produced from Bisphenol A epoxy resin. It is a polymer-type epoxy resin with epoxy functional group at the both ends. It can be used to add toughness, insulating and vapor barrier properties, and resistance to heat, water and chemicals in a variety of applications. FeaturesHigh molecular weightHigh softening pointsGood film formerHydrolysis resistanceFlexibilityStrong adhesionApplicationsPCM, CAN, and other coatingsPaintsFiber-reinforced materialsThermoplasticsPrinted electronicsPlastic processing *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

SHIKOH™ UT-7792 is a bio-based urethane acrylate oligomer. (Development product) Its biomass degree is 71% while its mechanical properties are the same as a non-biomass grade UV-3300B, with higher elongation and very soft rubbery elasticity suitable for using UV-curable adhesives for electronics devices. Features Bio-based Soft-elastic, High elongation Suitable for adhesion bond and metalizing undercoat with monomers Non-yellowing Applications Adhesive : UV/ EB/ Thermal-curable adhesive for electronics device, optical use, and automotive use. 3D printer *SHIKOH™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

SHIKOH™ UV-3300B is UV curable urethane acrylate oligomer with excellent soft-elasticity, and very high elongation. It also shows good mechanical properties even at low temperature. EB and Thermal cure systems are also applicable. Features Soft-elastic, High elongation Suitable for adhesion bond and metalizing undercoat with monomers Good mechanical properties at low temperature Non-yellowing Applications Adhesive : UV/ EB/ Thermal-curable adhesive for electronics device, optical use, and automotive use. 3D printer *SHIKOH™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ 1750 is a very low viscosity Bisphenol F-type liquid epoxy resin. It can be used in sealants, casting agents and adhesives in electrical and electronic applications and fiber reinforced plastics, and for liquid underfill and adhesives for semiconductor manufacturing.FeaturesChemical, heat and water resistanceElectrical insulation*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

WACKER® Crosslinker V 24 is a solvent-free hydrogenpolysiloxane that contains reactive Si-H groups. It offers a good cure, ensuring the effective curing of coatings. This crosslinker provides low release properties, making it suitable for applications where minimal release is desired. It also exhibits good release stability, maintaining its performance over time. Additionally, WACKER® Crosslinker V 24 demonstrates excellent anchorage to paper and film substrates.

CRA® eco 17 is an extremely efficient controlled release additive used for adjusting the release force of solvent-free DEHESIVE® systems. It is derived from renewable raw materials and complies with the "Standard REDcert²." CRA® eco 17 offers the highest release values among all CRA® modifiers.