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Evonik
TEGO® Antifoam 1488
Chemical Family:
Polyether Siloxanes
Functions:
Foaming Agent, Anti-Foaming Agent, Defoamer, Processing Aid
Applicable Processes:
Emulsion Polymerization, Polymer Dispersions Manufacturing, Textile Sizing
Compatible Substrates & Surfaces:
Paper, Wood
TEGO® Antifoam 1488 is a versatile emulsion-based anti-foaming agent tailored for various applications. It effectively controls foam formation in processes like emulsion polymerization and textile sizing. With good compatibility, it finds use in diverse industrial additives, including metalworking fluids and nonwovens. This emulsion-type additive is available in drums, catering to different production scales. Its performance spans markets like adhesives and sealants, fluids and lubricants, and building materials. TEGO® Antifoam 1488's role in polymer dispersions manufacturing adds to its versatility and value.
Evonik
TEGO® Antifoam 2-89
Chemical Family:
Polyether Siloxanes, Siloxanes
Functions:
Anti-Foaming Agent
Labeling Claims:
APEO-Free, Heavy Metal-free, Silicon-Oil Free, Allergen-free, Nanomaterials-free
Solid Content::
20.0 - 20.0 %
TEGO® Antifoam 2-89 is an antifoam emulsion formulated with organo-modified siloxanes. This product functions as an anti-foaming agent, offering good compatibility with industrial processes. It belongs to the Industrial Additives and Materials category within the Construction Chemicals product family and is specifically tailored for use in cement and concrete additives.
Evonik
TEGO® Antifoam KS 53
Chemical Family:
Polysiloxane, Organomodified
Functions:
Anti-Foaming Agent
Labeling Claims:
APEO-Free
Applicable Processes:
Wastewater Treatment, Suspension Polymerization, Polymerization
Solid Content::
100.0 - 100.0 %
TEGO® Antifoam KS 53 is a self-emulsifying organic antifoam concentrate, free of APEOs, and based on food-grade vegetable oil It includes minor quantities of organo-modified siloxanes to enhance its efficiency. It functions as an anti-foaming agent and is well-suited for processes such as polymerization and suspension polymerization.
Evonik
TEGO® Antifoam 2291
Functions:
Anti-Foaming Agent
Labeling Claims:
Silica-free, Silicone-free, APEO-Free
Applicable Processes:
Polymerization
Compatible Polymers & Resins:
Polyvinyl Alcohol (PVOH), Nitrile Butadiene Rubber (NBR), Polyurethanes (PU), Styrene Butadiene Rubber (SBR), Vinyl Acetate-Ethylene Copolymer (VAE)
Solid Content::
100.0 - 100.0 %
TEGO® Antifoam 2291 is a silicone-free, self-emulsifying antifoam concentrate without any silica. This APEO-free organic antifoam is designed for use as an anti-foaming agent in waterborne adhesive formulations, aligning with eco-friendly labeling claims. Categorized under CASE ingredients within foam control additives.
Evonik
TEGO® Antifoam 204
Chemical Family:
Polyether Siloxanes
Functions:
Anti-Foaming Agent
Labeling Claims:
Silicon-Oil Free, APEO-Free
Solid Content::
20.0 - 20.0 %
TEGO® Antifoam 204 is an antifoam emulsion formulated with organo-modified siloxanes. This product functions as an anti-foaming agent, offering good compatibility with industrial processes. It belongs to the Industrial Additives and Materials category within the Construction Chemicals product family and is specifically tailored for use in cement and concrete additives.
Evonik
AEROSIL® R 202
INCI Name:
Silica Dimethicone Silylate
Chemical Name:
Hydrated Silica, Silanamine, 1,1,1-trimethyl-N-(trimethylsilyl)-,hydrolysis products with silica, Silica gel, pptd., cryst.-free
Functions:
Viscosity Modifier, Thickener, Thixotrope, Rheology Modifier, Defoamer
Chemical Family:
Silica
AEROSIL® R 202 is a hydrophobic fumed silica grade, treated with a polydimethylsiloxane. This product can be used in defoamer formulations for sedimentation stabilization and due to its high hydrophobicity as defoaming component.
Evonik
AEROSIL® R 812
INCI Name:
Silica Silylate
Chemical Name:
Silica gel, pptd., cryst.-free
Functions:
Rheology Modifier, Viscosity Modifier, Processing Aid, Anti-Caking Agent, Thickener
CAS Number:
112926-00-8
Chemical Family:
Silica
AEROSIL® R 812 is hydrophobic fumed silica grade treated with HMDS (Hexamethyldisilazane). It can be used for sedimentation stabilization and due to its high hydrophobicity as defoaming agent.
Evonik
AEROSIL® 200
INCI Name:
Silica
Chemical Name:
Pyrogenic Silica, Silica gel, pptd., cryst.-free
Functions:
Viscosity Modifier, Anti-Settling Agent, Thickener, Rheology Modifier
CAS Number:
112926-00-8
Chemical Family:
Silica
AEROSIL® 200 is a hydrophilic fumed silica with a specific surface area of 200 m²/g.
Evonik
AEROSIL® R 805
INCI Name:
Silica Caprylyl Silylate
Chemical Name:
Silica gel, pptd., cryst.-free
Functions:
Rheology Modifier, Thickener, Viscosity Modifier
CAS Number:
112926-00-8
Chemical Family:
Silica
AEROSIL® R 805 is a high thickening fumed silica surface treated with OCTMO.
Evonik
AEROSIL® R 972
INCI Name:
Silica Dimethyl Silylate
Chemical Name:
Silica Dimethyl Silylate, Silica gel, pptd., cryst.-free
Functions:
Viscosity Modifier, Processing Aid, Thickener, Rheology Modifier
CAS Number:
112926-00-8
Chemical Family:
Silica
AEROSIL® R 972 is hydrophobic fumed silica grade treated with DDS (Dichlordimethylsilane). The moderate hydrophobicity of these AEROSIL® products is suited for defoaming properties in the presence of appropriate hydrophobic liquids. They are recomended for improving the sedimentation stability of defoamer dispersions as well.
Wacker Chemie AG
VINNAPAS® EP 11 (CGN)
Chemical Family:
Vinyl Acetate Ethylene (VAE) Copolymer
Compatible Substrates & Surfaces:
Wood, Plastics
Glass Transition Temperature (Tg):
3.0 - 3.0 °C
Features:
Frost Resistance
VINNAPAS® EP 11 (CGN) is an aqueous, plasticizer-free polymer dispersion based on vinyl acetate and ethylene monomers. It offers good adhesion to various plastic surfaces, resulting in a permanently flexible glue line. This product is particularly suitable for applications such as adhesives for paper packaging and PVC furniture foil adhesives.
Wacker Chemie AG
VINNAPAS® EP 14
Chemical Family:
Vinyl Acetate Ethylene (VAE) Copolymer
Compatible Substrates & Surfaces:
Wood, Plastics
Glass Transition Temperature (Tg):
3.0 - 3.0 °C
Features:
Frost Resistance
VINNAPAS® EP 14 is an aqueous, plasticizer-free polymer dispersion produced from the monomers vinyl acetate and ethylene. It exhibits good adhesion to various plastic surfaces and provides a permanently flexible glue line. This product is suitable for applications such as adhesives for paper packaging and PVC furniture foil adhesives.
Wacker Chemie AG
VINNAPAS® EP 24
Chemical Family:
Vinyl Acetate Ethylene (VAE) Copolymer
Compatible Substrates & Surfaces:
Wood, Plastics
Glass Transition Temperature (Tg):
3.0 - 3.0 °C
Features:
Tack-free, Improves Adhesion, Frost Resistance
VINNAPAS® EP 24 is an aqueous polymer dispersion, free from plasticizers, that is produced from vinyl acetate and ethylene monomers. It offers good adhesion to various plastic surfaces, resulting in a permanently flexible glue line. This product is particularly suitable for applications such as adhesives for paper packaging and PVC furniture foil adhesives.
Wacker Chemie AG
VINNAPAS® EP 401
Compatible Substrates & Surfaces:
Paper, Wood
Glass Transition Temperature (Tg):
-7.0 - -7.0 °C
Features:
Excellent Emulsifiability, Improved Cohesion, Fast Setting, Improves Adhesion, Frost Resistance
VINNAPAS® EP 401 is an aqueous, plasticizer-free polymer dispersion produced from the monomers vinyl acetate and ethylene. It offers good adhesion to various plastic surfaces, resulting in permanently flexible adhesive joints. Additionally, it demonstrates good reemulsification properties and has a high setting speed, making it well-suited for nozzle application.
Wacker Chemie AG
VINNAPAS® eco EP 401
Glass Transition Temperature (Tg):
-7.0 - -7.0 °C
Features:
Excellent Emulsifiability, Fast Setting
VINNAPAS® eco EP 401 is an environmentally friendly product designed to save fossil resources. It allows for the replacement of a portion of the fossil-based raw materials with certified sustainable, renewable feedstock during manufacturing. This product offers excellent adhesion to various plastic surfaces and creates permanently flexible adhesive joints. It also provides good reemulsification properties and has a high setting speed. VINNAPAS® eco EP 401 is well-suited for nozzle application.
Wacker Chemie AG
VINNAPAS® EP 1
Chemical Family:
Vinyl Acetate Ethylene (VAE) Copolymer
Compatible Substrates & Surfaces:
Wood, Plastics
Glass Transition Temperature (Tg)::
1.0 - 1.0 °C
Features:
Frost Resistance
VINNAPAS® EP 1 is a plasticizer-free polymer dispersion based on vinyl acetate and ethylene monomers. It exhibits good adhesion to various plastic surfaces, providing a permanently flexible glue line. It is particularly suitable for applications such as adhesives for paper packaging and PVC furniture foil adhesives.
Wacker Chemie AG
VINNAPAS® eco EP 400
Chemical Family:
Vinyl Acetate Ethylene (VAE) Copolymer
Compatible Substrates & Surfaces:
Plastics
Glass Transition Temperature (Tg)::
5.0 - 5.0 °C
Features:
Improves Adhesion, Improved Cohesion
VINNAPAS® eco EP 400 is an aqueous, plasticizer-free polymer dispersion produced from the monomers vinyl acetate and ethylene. This product exhibits good adhesion to various plastic surfaces, allowing for the creation of permanently flexible adhesive joints. Additionally, it offers high cohesion, ensuring strong bonding properties.
Wacker Chemie AG
VINNAPAS® EP 400
Chemical Family:
Vinyl Acetate Ethylene (VAE) Copolymer
Compatible Substrates & Surfaces:
Wood, Plastics, Paper
Glass Transition Temperature (Tg)::
5.0 - 5.0 °C
Features:
Improves Adhesion, Frost Resistance, Improved Cohesion
VINNAPAS® EP 400 is an aqueous, plasticizer-free polymer dispersion produced from the monomers vinyl acetate and ethylene. It exhibits good adhesion to various plastic surfaces, resulting in permanently flexible adhesive joints with high cohesion. It is suitable for a range of applications, including adhesives for paper packaging and PVC furniture foil adhesives.
Blackburn Chemicals
Dispelair® CF 393
Functions:
Defoamer
Chemical Family:
Silicones
Physical Form:
Liquid
Dispelair® CF 393 is a modified silicone-based foam control agent that is particularly effective in HPEG based systems. It is highly effective, particularly in HPEG PCE production & is SVHC label free.
Blackburn Chemicals
Dispelair® P 864
Functions:
Defoamer
Chemical Family:
Silica
Physical Form:
Solid, Powder
Dispelair® P 864 is a foam control for the construction industry having the benefits of lower unit cost & used for general purpose.
Blackburn Chemicals
Dispelair® CF 394
Functions:
Defoamer
Chemical Family:
Polyols, Polyglycols
Features:
Good Compatibility
Physical Form:
Liquid
Dispelair® CF 394 is a polyglycol based foam control agent. It is suitable for use in all types of PCES, highly effective in HPEG, MPEG and VPEG PCE production and are particularly effective when high compatibility and clarity are required within the PCE.
Blackburn Chemicals
Dispelair® CF 395
Functions:
Defoamer
Chemical Family:
Polyols, Polyglycols
Features:
Good Compatibility
Physical Form:
Liquid
Dispelair® CF 395 is a polyglycol based foam control agent. It is suitable for use in all types of PCES, highly effective in HPEG, MPEG and VPEG PCE production and are particularly effective when high compatibility and clarity are required within the PCE.
Blackburn Chemicals
Dispelair® P 540
Functions:
Defoamer
Chemical Family:
Silica
Physical Form:
Solid, Powder
Dispelair® P 540 is a new low carbon footprint powder foam control agent. Dispelair® P 540 has a much lower carbon footprint than a standard product, but with equal performance in self-leveling compounds.
SACO AEI Polymers
CAPXIDAN® HD
Polymer Name:
Polyethylene Copolymer
Processing Methods:
Extrusion
Melt Flow Index:
1.0 - 1.0 g/10 min
CAPXIDAN® HD is a Modified Copolymer produced with a proprietary, specialized formulation. It is designed to be coextruded over Wood-Plastic Composite (WPC) deck boards to provide moisture, stain, wear resistance,esthetics, durability at elevated temperatures, and unprecedented adhesion to the WPC substrate. CAPXIDAN® HD is a two-component capstock system. The CAPXIDAN® resin should be extruded together with a specific synergistic additive masterbatch in the recommended proportion of 98:2 by weight.
REXtac
REXtac RT9721
Glass Transition Temperature (Tg):
-10.0008 - -10.0008 °C
RT9721 is Formulated Butene Copolymer which is mainly used in Automotive load floor assembly, Pipe wrap, Specialty packaging, Mattress assembly, Office furniture, Foam bonding.
REXtac
REXtac BG201
Applications:
Sealants & Caulks, Other Packaging & Paper Applications, Tape & Label Adhesives
Product Families:
Other Resins & Binders, Resins & Binders
Chemical Family:
Olefins
BG201 is formulated APAO polymer which is mainly used in automotive load floor assembly, headliner components, automotive vibration/sound deadening, carpet backing, specialty packaging, woodworking, foam bonding.
REXtac
REXtac RT9745
Applications:
Sealants & Caulks, Other Packaging & Paper Applications, Tape & Label Adhesives
Product Families:
Other Resins & Binders, Resins & Binders
Chemical Family:
Olefins
RT9745 is Formulated Butene Copolymer which is mainly used in Automotive load floor, Specialty packaging, Mattress assembly, Foam bonding.
Suncolor Corporation
SUNSPHERES™ 03.0
Functions:
Filler
Chemical Family:
Silica
Optically clear, solid fused amorphous silica microspheres specially engineered for optimum dispersion in paints, coatings, inks, adhesives, and thermoplastics, including UV curable compositions. These microspheres increase corrosion and impact resistance, reduce shrinkage, improve adhesion, and enhance surface qualities including mar and scratch resistance. Ideally suited for specialty applications where mechanical and rheological properties are required. Median particle size of 3 to 4 microns, with a particle size range of 0.5 microns to 92% passing 22 microns.
REXtac
REXtac RT6275
Glass Transition Temperature (Tg):
-12.7788 - -12.7788 °C
RT6275 is Formulated Ethylene Copolymer which is mainly used in Automotive bilaminate interior applications below the beltline, Point of sale display, Woodworking, Office furniture, Foam bonding, Automotive cabin air filters, HVAC filters, Electronics - overmolding/low pressure molding systems.
REXtac
REXtac RT6723
Applications:
Sealants & Caulks, Other Packaging & Paper Applications, Tape & Label Adhesives
Product Families:
Other Resins & Binders, Resins & Binders
Chemical Family:
Olefins
RT6723 is Formulated Butene Copolymer which is mainly used in Automotive load floor assembly, Headliner components, Automotive vibration/sound deadening, Bilaminate interior applications above and below the beltline, Carpet backing, Point of sale display, Specialty packaging, Mattress assembly, Woodworking, Office/hotel panel assembly, Office furniture, Foam bonding.
Suncolor Corporation
SUNSPHERES™ 200 Nm
Functions:
Reinforcement, Filler
Chemical Family:
Calcium Salts, Silica
End Uses:
Radiation Curable Coating, Primer, Waterborne Coating, Marine Applications, Lighting Applications, Solventless & High Solids Coating, Aerospace Applications, Enamel
Sunspheres™ 200 Nm are optically clear, solid fused amorphous microspheres designed for use in a wide variety of coatings, inks, adhesives, powder coatings, and thermoplastics, including UV curable compositions. These sub-micron sized spheres can be used to improve physical and mechanical properties including reduced shrinkage, improved adhesion, impact resistance, and enhanced surface qualities such as hardness, mar and scratch resistance. The average particle size is 200 nanometers and range in size from about 50 nm to 500 nm.
Suncolor Corporation
SUNSPHERES™ 200 Nm ST-3
Functions:
Reinforcement, Filler
Chemical Family:
Silica, Carbonates
End Uses:
Radiation Curable Coating, Primer, Waterborne Coating, Marine Applications, Top Coat, Lighting Applications, Solventless & High Solids Coating, Aerospace Applications
The Sunspheres™ 200 Nm ST- 3 are surface treated*, optically clear, solid fused amorphous microspheres designed for optimum dispersion in coatings, inks, adhesives, and thermoplastics, including UV curable compositions. Cured films show enhanced physical and mechanical properties including increased corrosion resistance, reduced shrinkage, improved adhesion, and enhanced surface qualities such as mar and scratch resistance. This product is particularly useful in improving impact resistance. The average particle size is 200 nanometers and range in size from 50 to 500 nm.
SACO AEI Polymers
CAPXIDAN® LG
Polymer Name:
Polyethylene Copolymer
Processing Methods:
Coextrusion
Melt Flow Index:
0.4 - 0.4 g/10 min
CAPXIDAN® LG is a modified copolymer produced with a proprietary, patent pending formulation. It is designed to be coextruded over Wood-Plastic Composite (WPC) deckboards to provide moisture, stain and wear resistance, esthetics, low gloss, durability at elevated temperatures, and unprecedented adhesion to the WPC substrate. CAPXIDAN® LG is a two-component capstock system. The CAPXIDAN® resin should be extruded together with a specific synergistic additive masterbatch in the recommended proportion of 98:2 by weight.
Georgia-Pacific Chemicals
GP BRSD-2112
Chemical Family:
Phenols & Phenolics
GP® BRSD-2112 coating/adhesive resin is a liquid heat-reactive phenolic-based resin solution.
Suncolor Corporation
SUNSPHERES™ 15.0
Functions:
Filler
Chemical Family:
Silica
Optically clear, solid fused amorphous silica microspheres specially engineered for paints, coatings, inks, adhesives, and thermoplastics, including UV curable compositions. These microspheres increase corrosion resistance, reduce shrinkage, improve adhesion and impact resistance, and enhance surface qualities including mar and scratch resistance. The Sunspheres™ 15.0 have a median particle size of approximately 15.0 microns, with 90% of particles passing 45 microns.
REXtac
REXtac E101
Glass Transition Temperature (Tg):
-12.7788 - -12.7788 °C
E101 is formulated APAO polymer which is mainly used in personal hygiene, baby diapers, nonwoven gowns and drapes, incontinence mattress pads, nonwoven dental bibs, pet training pads, mattress assembly, foam bonding, fiber optic assembly.
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